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Boron nitride modification and its incorporation into PMMA/PA6 polymer blend

Abstract : Polymers are thermally insulating materials, which limits their use in some specific fields such as the electronics industry. One way to improve the thermal conductivity of polymers is the introduction of a ceramic filler, in particular hexagonal boron nitride (h-BN), which has recently gained much attention due to its high thermal conductivity and low electrical conductivity [1]. Moreover, by localizing h-BN platelets in one phase or at the interface of a polymer blend, the thermal conductivity can be improved [2]. This localization can be guided by a chemical modification of the h-BN. In this work it is proposed to evaluate the impact of the chemical modification of h-BN for their use in PMMA/PA6 polymer blend.
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Soumis le : lundi 31 octobre 2022 - 13:38:49
Dernière modification le : mardi 15 novembre 2022 - 16:57:45


  • HAL Id : hal-03835121, version 1


Abdelwahab Boukheit, France Chabert, Belkacem Otazaghine, A. Taguet. Boron nitride modification and its incorporation into PMMA/PA6 polymer blend. ISPN 2022– International Symposium on Polymer Nanocomposites, Sep 2022, Lorient, France. ⟨hal-03835121⟩



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