Polymers are thermally insulating materials, which limits their use in some specific fields such as the electronics industry. One way to improve the thermal conductivity of polymers is the introduction of a ceramic filler, in particular hexagonal boron nitride (h-BN), which has recently gained much attention due to its high thermal conductivity and low electrical conductivity [1]. Moreover, by localizing h-BN platelets in one phase or at the interface of a polymer blend, the thermal conductivity can be improved [2]. This localization can be guided by a chemical modification of the h-BN. In this work it is proposed to evaluate the impact of the chemical modification of h-BN for their use in PMMA/PA6 polymer blend.